Samsung Galaxy S6 Hardware Details Leaked

Earlier, Samsung hinted that its design team was going to roll out a completely new design for the company’s upcoming Galaxy S6 smartphone. The design will expeditiously change the overall aesthetics of the mobile device, not to mention being incorporated with a more durable and premium exterior. Samsung is expected to shift away from assimilating the inexpensive plastic exterior to its smartphones and has thus placed the Galaxy S6 under the Project name ‘Zero’.

The Galaxy S6 is expected to be housing impressive hardware, including a component that has been made thanks to the collaboration of Qualcomm and Toshiba. Both companies have decided to bring about what they refer to as the UFS 2.0 solution. This solution will replace the obsolete eMMC flash storage, and end up making the flash memory of the smartphone long lasting, energy efficient and extremely fast.

UFS technology is currently present in Qualcomm’s Snapdragon 805 chipset, with compatibility to be stretched out to future chipsets as well. According to different sources, the Galaxy S6 will be shipped out in two different chipset models. One will be running the Qualcomm Snapdragon 810 chipset, while the other will be running Samsung’s own Exynos 7420 octa-core chipset. Both of the chipset’s processors will support the 64 bit architecture.

In addition, the Samsung Galaxy S6 will most likely be running Android Lollipop 5.0 and will come in the 32, 64, 128 GB of internal storage variants. Similar to the Galaxy S5 and the Note 4, the Samsung Galaxy S6 is also expected to provide a maximum expandable storage limit of 128 GB via microSD card. As for the remainder of the specifications, it can only be speculated that the device will possess a 5 inch screen size that will be radiating a 1440p resolution. Perhaps the introduction of a smartphone design will allow the company to garner substantial revenue in the future and end its period of financial drought.


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